Grade: CG-560
trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane
CG-560 (trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane) is an epoxy-functional coupling agent used in polysulfide and polyurethane sealants and adhesives, epoxy resin adhesives, filled or reinforced thermosetting resins, glass fiber adhesives, and inorganic-filled or glass-reinforced thermoplastic resins.
- CAS No.: 2530-83-8
- EC No.: 219-784-2
- Molecular Formula: C9H20O5Si
- Structural Formula
- Synonyms: 3-Glycidyloxypropyltrimethoxysilane3-Glycidoxypropyl trimethoxysilaneGlycidyl 3-Trimethoxysilylpropyl EtherGOPTS[3-(2,3-Epoxypropoxy)-propyl]-trimethoxysilaneGlycidoxypropyltrimethoxysilaneGPTMS
- Appearance: colorless, transparent liquid
- Purity: ≥97%
- Density (20 °C): 1.060-1.080 g/cm3
- Boiling point: 262 °C
- Solubility: soluble in water、hydrolyzes simultaneously,hydrolysis releases methanol。soluble in alcohols,acetone and at normal use levels below 5%soluble inmost aliphatic esters
- Flash point: 122 °C
Packaging and Storage
This product can be packaged in 25 kg plastic drums, 200 kg plastic drums, or steel drums. Other package sizes are available upon request. Store in a cool, well-ventilated, dry place in tightly sealed containers, protected from light. Keep away from moisture and sources of ignition. Ensure the lid is tightly sealed and effectively isolates the product from air; moisture in the air can react quickly, thereby leading to hydrolysis and polymerization. Shelf life in the original unopened packaging is one year. This product is irritating to skin and eyes. If it contacts skin, wash with soap. If it contacts eyes, rinse immediately with plenty of water.
Application
CG-560 is used in polysulfide and polyurethane sealants and adhesives, epoxy resin adhesives, filled or reinforced thermosetting resins, glass fiber adhesives, and inorganic-filled or glass-reinforced thermoplastic resins.
CG-560 improves the strength properties of hard composites reinforced with glass fiber roving, maintaining maximum strength properties after the conditioning period.
CG-560 enhances the electrical performance of epoxy-based electronic sealants, encapsulants, and printed circuit boards by improving the bonding strength between the resin and substrate or filler.
CG-560 enhances the electrical properties of many filled composites, including nylon and polybutylene terephthalate.
CG-560 is effective with a wide range of fillers and substrates such as clay, talc, wollastonite, silica, quartz, or metals including aluminum, copper, and iron.
CG-560 improves the compatibility, dispersibility, and flowability of the binder in organic toners.
